Thursday, June 22, 2017

Thesis on Open-Source Eye Tracking Database

Presenting PhD thesis for discussion a week before the defense seems to become a new trend in Finland. University of Eastern Finland presents PhD Thesis by Ana Gebejes entitled "Spectral video: application in human eye analysis and tracking" to be defended on June 30, 2017.

Using a 450nm-950nm spectral video device in eye-tracking, the researchers from the University of Eastern Finland have created a novel – first of its kind – combined spectral video/spectral image database: the SPectral Eye vidEo Database, SPEED.


A Youtube video explains the database creation work:

Caltech Presents OPA Camera

Caltech Professor Ali Hajimiri with graduate students present Optical Phase Array (OPA)-based camera: "What the camera does is similar to looking through a thin straw and scanning it across the field of view. We can form an image at an incredibly fast speed by manipulating the light instead of moving a mechanical object." Their OSA paper "An 8x8 Heterodyne Lens-less OPA Camera" explains the principle:

The OPA chip placed on a penny for scale.

2016 Gartner Image Sensor Report

InstantFlashNews publishes August 2016 Gartner report on image sensor market. A few quotes from the report:

Key Findings:
  • The growth in the biggest market for CMOS image sensors — smartphones — is ebbing. Leading suppliers are focusing on new markets, such as automotive, industrial and wearables, to drive revenue growth.
  • Capturing share in new markets requires new camera technologies, such as 3D cameras, dual cameras, software technologies, and algorithms for image processing and recognition.
  • New safety regulations for automobiles are emerging across key markets, such as North America, Europe, Japan and China. Compliance with these regulations will demand increased use of image sensors in a variety of automobile electronic equipment over the next three years.

CMOS image sensor product managers must:
  • Focus on developing specific products targeting new markets, such as industrial, automotive and wearable devices, and allocate resources to gain share quickly in these markets.
  • Develop computational camera software technologies and algorithms, such as high-speed processing, image recognition (face or object) and AI technologies, which will be adopted into, for example, the smartphone, automotive and industrial markets. And they should integrate them into one chip or a single package.
  • Consider acquiring packaging, lens and camera module suppliers and IP companies (image signal processors, connectivity, memory and artificial intelligence) to provide a complete product to the end customer.

Wednesday, June 21, 2017

TechInsights Survey of Stacked Image Sensors

TechInsights publishes a second blog post based on Ray Fontaine presentation at IISW 2017. This part covers stacked image sensor technology from TSV and oxide bonding to Cu-to-Cu direct bonding in the recent products:

IISW 2017 Awards

IISW 2017 held on May 30-June 2 in Hiroshima, Japan has announced a number of Awards:

2017 Walter Kosonocky Award for the best paper published in 2015-16 goes to

A 0.13 μm CMOS System-on-Chip for a 512 × 424 Time-of-Flight Image Sensor With Multi-Frequency Photo-Demodulation up to 130 MHz and 2 GS/s ADC
Cyrus S. Bamji, Patrick O’Connor, Tamer Elkhatib, Swati Mehta, Barry Thompson, Lawrence A. Prather, Dane Snow, Onur Can Akkaya, Andy Daniel, Andrew D. Payne, Travis Perry, Mike Fenton, and Vei-Han Chan
Microsoft, USA, IEEE JSSC, Vol. 50, No. 1, pp. 303-318, January 2015


Pioneering Achievement Award for Contribution to R&D and commercialization of high-performance and high-resolution CCD image sensors is presented to Tetsuo Yamada:


Exceptional Lifetime Achievement Award Significant Contributions to the Advancement of Solid-State Image Sensors Including the Development Of On-chip Microlens Technology and VOD Structures for anti-blooming is presented to Yasuo Ishihara:


The Best Poster Award goes to:

Fully Depleted, Monolithic Pinned Photodiode CMOS Image Sensor Using Reverse Substrate Bias
Konstantin D. Stefanov, Andrew S. Clarke, James Ivory and Andrew D. Holland. The Open University, UK


Thanks to JN for the docs!

Tuesday, June 20, 2017

Sony Enhances IR Sensitivity by 80% with Pyramidal Structure

Sony publishes an open access paper in Nature Journal "IR sensitivity enhancement of CMOS Image Sensor with diffractive light trapping pixels" by Sozo Yokogawa, Itaru Oshiyama, Harumi Ikeda, Yoshiki Ebiko, Tomoyuki Hirano, Suguru Saito, Takashi Oinoue, Yoshiya Hagimoto & Hayato Iwamoto. From the abstract:

"We report on the IR sensitivity enhancement of back-illuminated CMOS Image Sensor (BI-CIS) with 2-dimensional diffractive inverted pyramid array structure (IPA) on crystalline silicon (c-Si) and deep trench isolation (DTI)... A prototype BI-CIS sample with pixel size of 1.2 μm square containing 400 nm pitch IPAs shows 80% sensitivity enhancement at λ = 850 nm compared to the reference sample with flat surface. This is due to diffraction with the IPA and total reflection at the pixel boundary."


The papers's conclusion:

"A novel BI-CIS with IPA on c-Si surface for light trapping pixel technology is proposed and the prototyping results are demonstrated. Both spectroscopic measurements and demo images show considerable NIR sensitivity enhancement with small spatial resolution degradation. BI-CIS with 400 nm pitch IPA surface and DTI shows 80% improvement in sensitivity, which corresponds to QE of more than 30% at 850 nm for a 3 μm thick c-Si photodetector. Furthermore, it is worth noting that there is still a lot of room for improvement toward the fundamental limit of 4n^2. Additionally, it is important to control surface passivation to minimize the degradation of thermal noise and also further improve pixel isolation to reduce lateral color crosstalk as small as possible."

Monday, June 19, 2017

Intel RealSense CTO Presentation

Augmented World Expo (AWE) publishes a presentation by Intel RealSense group CTO, Anders Grunnet Jepsen:



One of the new RealSense depth cameras

Thanks to ZR for the link!

Samsung CIS Business Update

Samsung Investor Presentation gives interesting details on the company CIS business progress.

The market share data shows the business expansion:


Samsung uses 28nm CIS process, while Sony extends 65nm process life:


Automotive and mobile are high-priority applications:

Sunday, June 18, 2017

Plasmonic Filters Found in Mass Produced Device

SystemPlus reverse engineering of NanoLambda NSP32-V1 spectrometer discovers plasmonic filters inside:

"The NSP32-V1 spectrometer uses a 1024 pixel, 32 x 32, nano-optical filter array to measure the light spectrum, based on a technological breakthrough, the plasmonic filter. This is a metal film perforated with subwavelength hole arrays. It is manufactured within the metal layer of the silicon die, giving a monolithic solution.

The 100μm-high sensor die is assembled in an advanced ball grid array (BGA) package with an optical window for only 500μm height. The other optical parts, the lens and the diffuser, are assembled in a 5.7mm-high module. The module is very small overall, at just 6mm x 6mm x 5.3mm.
"

Saturday, June 17, 2017

High-Speed Low-Noise Column ADC Architectures Thesis

Shizuoka University, Japan, publishes PhD Thesis "A Study on High-Speed Low-Noise Readout Architectures and Column A/D Converters for CMOS Image Sensors" by Tongxi Wang. The thesis starts with a nice overview of the readout and column-parallel ADC concepts:


A Hybrid Tri-Stage-Pipeline Column ADC (TSP) architecture is proposed to achieve the better trade-offs (implemented in 65nm process):


Another proposal is Folding-Integration/Cyclic Cascaded ADC (FICC) (implemented in 110nm process):